2008
2008 year
First time entry into laser industry. Lead applied laser technology to the photovoltaic sector. This paves the way to the creation of laser business division (predecessor of LeadLaser).
2013
2013 year
Lead broadened the application into 3C sector, further enabling expansion of business map of laser business division.
2018
2018 year
Entry into the display panel field. Lead developed fully automatic cutting machine, laser marking machine and laser repair system among others.
2019
2019 year
Entry into the semiconductor, FPC and micro LED sectors. Lead developed wafer marking machine, laser grooving, wafer drilling machine, strip cutting machine, strip marking machine among others.
2020
2020 year
Complete laser intelligent manufacturing turnkey solution. The range covers the four major fields of drilling, cutting, marking and welding with positive approval of major customers.
2022
2022 year
Became an independent business unit within Lead and renamed LeadLaser. Five major areas of business: Semiconductor, new display, consumer electronics, alternative energy, and display panel.
2008
2008 year
First time entry into laser industry. Lead applied laser technology to the photovoltaic sector. This paves the way to the creation of laser business division (predecessor of LeadLaser).
2013
2013 year
Lead broadened the application into 3C sector, further enabling expansion of business map of laser business division.
2018
2018 year
Entry into the display panel field. Lead developed fully automatic cutting machine, laser marking machine and laser repair system among others.
2019
2019 year
Entry into the semiconductor, FPC and micro LED sectors. Lead developed wafer marking machine, laser grooving, wafer drilling machine, strip cutting machine, strip marking machine among others.
2020
2020 year
Complete laser intelligent manufacturing turnkey solution. The range covers the four major fields of drilling, cutting, marking and welding with positive approval of major customers.
2022
2022 year
Became an independent business unit within Lead and renamed LeadLaser. Five major areas of business: Semiconductor, new display, consumer electronics, alternative energy, and display panel.
2008
2008 year
First time entry into laser industry. Lead applied laser technology to the photovoltaic sector. This paves the way to the creation of laser business division (predecessor of LeadLaser).
2013
2013 year
Lead broadened the application into 3C sector, further enabling expansion of business map of laser business division.
2018
2018 year
Entry into the display panel field. Lead developed fully automatic cutting machine, laser marking machine and laser repair system among others.
2019
2019 year
Entry into the semiconductor, FPC and micro LED sectors. Lead developed wafer marking machine, laser grooving, wafer drilling machine, strip cutting machine, strip marking machine among others.
2020
2020 year
Complete laser intelligent manufacturing turnkey solution. The range covers the four major fields of drilling, cutting, marking and welding with positive approval of major customers.
2022
2022 year
Became an independent business unit within Lead and renamed LeadLaser. Five major areas of business: Semiconductor, new display, consumer electronics, alternative energy, and display panel.
